Showing 41–60 of 193 results
AMAOE SAM6 Stencil For SAMSUNG C7010/J610/J3/J5/C7/A5 MSM8916/MSM8953 CPU RAM WIFI POWER Chip BGA Stencil IC Solder Reballing Tin Pin
AMAOE SAM7 Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
Amaoe Stencil MU1 for MTK CPUs (0.12MM) ensures precise soldering for mobile phone motherboard repairs. Compatible with multiple MTK chipsets like MT6795W, MT6797W, MT6595, MT6732, and MT6750.
Amaoe MU2 MTK CPU BGA Stencil is a high-quality template for reballing and direct heating of MTK ICs, including MT6582, MT6580A, MT6735, and MT6755 chips.
The Amaoe Stencil QU2 is designed for Qualcomm CPUs like MSM8953, MSM8916, and more. Ideal for mobile repair professionals, it ensures precise soldering.
Amaoe SWT1 Power CPU RAM Universal Reballing Schablone 0,12mm
Amaoe U-HiS3 UBGA BGA Reballing Stencil
Amaoe U-HiS4 UBGA BGA Reballing Stencil
Amaoe U-HiS5 UBGA BGA Reballing Stencil
Amaoe U-HIU2 UBGA BGA Reballing Stencil
AMAOE Stencil iPhone XS/XS Max/XR-A12
Amaoe U-IP7 0.12mm IP11 BGA Reballing Stencil for iPhone 11 / PRO / PRO MAX / Apple A13 CPU
Amaoe U-MIXU1 Stencil For HI36AO, SM8650, MT6985W, SM6450, MT6989W, SM4450
Amaoe U-MTK1 UBGA BGA Reballing Stencil
Amaoe U-MTK3 UBGA BGA Reballing Stencil
Amaoe U-MTK7 UBGA BGA Reballing Stencil
Amaoe U-MTU2 UBGA BGA Reballing Stencil
Amaoe U-MTU4 UBGA BGA Reballing Stencil