Showing 1–20 of 38 results
Amaoe 0.20mm Electronic Multi-function Universal (0.5-0.8 Spacing) BGA Reballing Stencil
The Amaoe EMMC2/UFS (EMMC/EMCP) Reballing Stencil 0.15mm is a high-quality reballing tool designed for mobile technicians, compatible with EMMC, EMCP, and UFS chipsets.
The Amaoe Emmc3 Stencil is a versatile, high-precision tool compatible with various BGA types, perfect for chip repair and reballing tasks.
Amaoe MI12 0.12mm BGA Reballing Stencil for Xiaomi 10 / 10 Pro Redmi K30 Pro Snapdragon 865 SM8250 CPU
Amaoe Mi15 0.12mm BGA Reballing Stencil for Xiaomi 12 / 12Pro / 12X Redmi K50 eSports Edition Qualcomm SM8450 / SM8250
Amaoe MI16 Stencil
Amaoe OV7 CPU Universal Series BGA Reballing Stencil for Snapdragon 7Gen1 / SM7450 / 680 / SM6225
Amaoe OV8 0.12mm CPU BGA Reballing Stencil for OPPO A96 VIVO Y77 Realme 10Pro IQOO U5 SM6375 MT6855V MT6833V
Amaoe U-UFS1 UBGA BGA Reballing Stencil
Drone AR9342 LCMX02 S1 LC1860C MA2100A H3 H6 LF-2100E ACPD4GD31D3 LC1160
Buy the Amaoe UAV2 BGA Reballing Stencil for repairing drone BGA chips like BGA96, BGA60, BGA200, and more. Exclusive price in Pakistan at www.kbgsmstore.com.
Original Amaoe Universal BGA IC Reballing Stencil, available in 0.3mm and 0.5mm sizes, perfect for PCB repairs and IC chip rework.
MaAnt Magnetic Power C1 Positioning Tin Planting Platform for EMMC / EMCP / UFS / Font Bank
Qianli & Mega Idea (QL-08) Maxim MAX Power Black Stencil 0.12MM
MEGA-IDEA Black Stencil Template 0.3/0.35/0.4/0.5mm
Mijing HW-4 Qualcomm WTR IC Stencil
OPPO OP1 Stencil Amaoe BGA Reballing Stencil For Oppo Vivo OP1 0.12MM
OPPO OP2 AMAOE Stencil CPU MSM8976 MSM8956 R9P/R9SP VIVO X6/X7/X9P/X9S/MI MAX